ETX 模塊
CPU模塊+擴(kuò)展底板=ETX模塊化系統(tǒng)，ETX CPU模塊需嵌入在擴(kuò)展專用底板上，CPU模塊本身帶有CPU和接口設(shè)備，能與聲卡，SVGA，以太網(wǎng)和其它I/O接口緊密結(jié)合。通過(guò)精密的連接器，連接在擴(kuò)展專用底板上，提供了所有的標(biāo)準(zhǔn)接口，如PCI/ISA總線和I/O接口，此設(shè)計(jì)結(jié)構(gòu)方便CPU模塊升級(jí)和更換，能讓客戶快速開(kāi)發(fā)設(shè)計(jì)自己的主板，使開(kāi)發(fā)周期減至4-6周，產(chǎn)品迅速推向市場(chǎng)。
ICE-DB-T10
Base Board for COM Express Type 10 Module support PICMG COM.0 R2.1
ICE-DB-T6R
Base Board for COM Express Type 6 Module COM.0 Rev. 2.1,support PICMG EAPI R1.0
ICE-BT-T10
COM Express Basic Type 10 module supports Intel® Atom, On-board 2GB DDR3L, VGA,DDI,GbE,SATA,USB 3.0,HD Audio,RoHS
ICE-BT-T6
COM Express Basic Type 6 module supports Intel® Celeron® Quad-Core CPU,VGA, DDI, LVDS, GbE, SATA, USB 3.0 and HD Audio, RoHS
ICE-ULT3
COM Express Compact size Type 6 Module, Intel® ULT CPU,DDR4, VGA, LVDS, DDI, GbE, SATAIII, USB 3.0 and HD Audio, RoHS
ICE-QM871
COM Express Basic Type 6模塊, Intel® Haswell Mobile BGA處理器, VGA, LVDS, 顯示接口, HDMI, SATA 6Gb/s, USB 3.0 GbE,以及HD 音頻, RoHS
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